HyperX HX426C15FBK2/8 is a kit of two 512M x 64-bit (4GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 8GB. Each module has been tested to run at DDR4-2666 at a low latency timing of 15-17-17 at 1.2V. Additional timing parameters are shown in the Plug-N-Play (PnP) Timing Parameters section below. The JEDEC standard electrical and mechanical specifications
are as follows:
Features:
??? Power Supply: VDD = 1.2V Typical
??? VDDQ = 1.2V Typical
??? VPP - 2.5V Typical
??? VDDSPD = 2.2V to 3.6V
??? Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
??? Low-power auto self-refresh (LPASR)
??? Data bus inversion (DBI) for data bus
??? On-die VREFDQ generation and calibration
??? Single-rank
??? On-board I2 serial presence-detect (SPD) EEPROM
??? 16 internal banks; 4 groups of 4 banks each
??? Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
??? Selectable BC4 or BL8 on-the-fly (OTF)
??? Fly-by topology
??? Terminated control command and address bus
??? Height 1.340??? (34.04mm), w/heatsink
JEDEC/XMP TIMING PARAMETERS
??? JEDEC/PnP:
- DDR4-2666 CL15-17-17 at 1.2V
- DDR4-2400 CL14-16-16 at 1.2V
- DDR4-2133 CL12-14-14 at 1.2V
???XMP Profile #1: DDR4-2666 CL15-17-17 at 1.2V
CL (IDD)
15 Cycles
Row Cycle Time (tRCmin)
45ns (min)
Refresh to Active/Refresh Command Time (tRFCmin)
260ns (min)
Row Active Time (tRASmin)
TBD
UL Rating
94V - 0
Operating Temperature
94V to 0
Storage Temperature
-55 C to +100 C
Item Dimension (L"xW"xH")
3 x 1 x 1
Weight
1.00 lb
Warranty Information
Lifetime Manufacture