Blade Server Chassis Comparision:HP C7000,IBM FlexSystem,Cisco UCS G3, Huawei E9000
Key Competitiveness
|
Key feature
|
HP C7000 G8
|
IBM FlexSystem
|
Cisco UCS G3
|
Huawei E9000
|
Engineering capability
|
heat dissipation for front ,rear slots and power supply
|
1200W/100W
|
1200W/100W
|
1200W/100W
|
1400W/280W
|
Computing capability
|
Computing density
|
32
|
56
|
16
|
64
|
Memory capacity
|
Memory capacity per chassis (mainstream granules)
|
8.2T
|
10.8T
|
6.14T
|
12.3T
|
Storage capability
|
2.5" disk quantity per slot
|
12
|
12
|
12
|
15
|
Computing and storage converged
|
External SAN
|
Internal SAN
|
External SAN
|
External SAN
Internal DS
|
network
|
Backplane Bandwidth
|
6.144Tbps
|
7.168Tbps
|
1.28Tbps
|
15.6Tbps
|
10GE/FCoE/8G FC/IB switch
|
Y
|
Y
|
Y
|
Y
|
40GE
|
Y
|
N
|
Y
|
Y
|
RoCE
|
N
|
Y
|
N
|
Y
|
16G FC
|
N
|
Y
|
N
|
N
|
PCIe expansion
|
PCIe resources expansion
|
N
|
2*PCIe 8x+2*PCIe 16x
|
N
|
4*PCIe 8x
or 2*PCIe 16x
|
Running environment
|
Ambient temperature
|
5°C~35°C
|
5°C~40°C
|
5°C~35°C
|
5°C~40°C
|