Blade Server Chassis Comparision:HP C7000,IBM FlexSystem,Cisco UCS G3, Huawei E9000
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Key Competitiveness
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Key feature
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HP C7000 G8
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IBM FlexSystem
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Cisco UCS G3
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Huawei E9000
|
|
Engineering capability
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heat dissipation for front ,rear slots and power supply
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1200W/100W
|
1200W/100W
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1200W/100W
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1400W/280W
|
|
Computing capability
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Computing density
|
32
|
56
|
16
|
64
|
|
Memory capacity
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Memory capacity per chassis (mainstream granules)
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8.2T
|
10.8T
|
6.14T
|
12.3T
|
|
Storage capability
|
2.5" disk quantity per slot
|
12
|
12
|
12
|
15
|
|
Computing and storage converged
|
External SAN
|
Internal SAN
|
External SAN
|
External SAN
Internal DS
|
|
network
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Backplane Bandwidth
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6.144Tbps
|
7.168Tbps
|
1.28Tbps
|
15.6Tbps
|
|
10GE/FCoE/8G FC/IB switch
|
Y
|
Y
|
Y
|
Y
|
|
40GE
|
Y
|
N
|
Y
|
Y
|
|
RoCE
|
N
|
Y
|
N
|
Y
|
|
16G FC
|
N
|
Y
|
N
|
N
|
|
PCIe expansion
|
PCIe resources expansion
|
N
|
2*PCIe 8x+2*PCIe 16x
|
N
|
4*PCIe 8x
or 2*PCIe 16x
|
|
Running environment
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Ambient temperature
|
5°C~35°C
|
5°C~40°C
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5°C~35°C
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5°C~40°C
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