Blade Server Chassis Comparision:HP C7000,IBM FlexSystem,Cisco UCS G3, Huawei E9000
Key Competitiveness |
Key feature |
HP C7000 G8 |
IBM FlexSystem |
Cisco UCS G3 |
Huawei E9000 |
Engineering capability |
heat dissipation for front ,rear slots and power supply |
1200W/100W |
1200W/100W |
1200W/100W |
1400W/280W |
Computing capability |
Computing density |
32 |
56 |
16 |
64 |
Memory capacity |
Memory capacity per chassis (mainstream granules) |
8.2T |
10.8T |
6.14T |
12.3T |
Storage capability |
2.5" disk quantity per slot |
12 |
12 |
12 |
15 |
Computing and storage converged |
External SAN |
Internal SAN |
External SAN |
External SAN Internal DS |
|
network |
Backplane Bandwidth |
6.144Tbps |
7.168Tbps |
1.28Tbps |
15.6Tbps |
10GE/FCoE/8G FC/IB switch |
Y |
Y |
Y |
Y |
|
40GE |
Y |
N |
Y |
Y |
|
RoCE |
N |
Y |
N |
Y |
|
16G FC |
N |
Y |
N |
N |
|
PCIe expansion |
PCIe resources expansion |
N |
2*PCIe 8x+2*PCIe 16x |
N |
4*PCIe 8x or 2*PCIe 16x |
Running environment |
Ambient temperature |
5°C~35°C |
5°C~40°C |
5°C~35°C |
5°C~40°C |