The H801TOPB is a TDM uplink interface board and uses the daughter board to transmit services upstream.

Benefits

Native TDM, featuring easy encapsulation and low network costs 

CESoP, a standard packet format, supporting interconnection between different vendors

External Interfaces

2 STM-1 ports

Functions
Native TDM	Supported
CESoP	Supported
Automatic shutdown at high temperature	Supported
Environment
Operating temperature	-40°C to +65°C
Power consumption	Static: 13 W Maximum: 16 W

Qty